带有储能衬底弹簧的硅微型机器人的初跳

2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) Pub Date : 2021-06-20 DOI:10.1109/Transducers50396.2021.9495685

Craig B. Schindler, Hani C. Gomez, K. Pister

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引用次数: 0

摘要

我们提出了一个微型机器人的第一次成功的跳跃在硅绝缘体上的硅(SOI)工艺制造的能量存储弹簧蚀刻到硅衬底。这款0.08克重的硅制机器人利用其内置的静电尺蠖电机存储8µJ的弹簧能量，在用绳索供电和控制时，可以垂直跳跃超过3毫米。该机器人的垂直跳跃高度比之前SOI机器人展示的高度高出3倍以上。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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First Jumps of a Silicon Microrobot with an Energy Storing Substrate Spring

We present the first-ever successful jumps of a microrobot fabricated in a silicon-on-insulator (SOI) process with an energy storing spring etched into the silicon substrate. The 0.08 gram silicon robot used its onboard electrostatic inchworm motor to store 8µJ of spring energy and vertically jump more than 3mm when powered and controlled with wire tethers. The robot's vertical jump height is more than 3X higher than what has been previously demonstrated by an SOI robot.

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来源期刊

2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)

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