{"title":"采用半导体应变片的传感器温度补偿","authors":"C. Shearer","doi":"10.1109/TA.1965.4319781","DOIUrl":null,"url":null,"abstract":"Temperature compensation of transducers using semiconductor strain gages involves an understanding of the interrelationships between basic sensor performance, transducer design and compensation techniques. This paper describes some of these interrelationships and gives specific information regarding conventional temperature compensation approaches used on production hardware.","PeriodicalId":13050,"journal":{"name":"IEEE Transactions on Aerospace","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"1965-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Temperature Compensation of Transducers Using Semiconductor Strain Gages\",\"authors\":\"C. Shearer\",\"doi\":\"10.1109/TA.1965.4319781\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Temperature compensation of transducers using semiconductor strain gages involves an understanding of the interrelationships between basic sensor performance, transducer design and compensation techniques. This paper describes some of these interrelationships and gives specific information regarding conventional temperature compensation approaches used on production hardware.\",\"PeriodicalId\":13050,\"journal\":{\"name\":\"IEEE Transactions on Aerospace\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1965-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Aerospace\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TA.1965.4319781\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Aerospace","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TA.1965.4319781","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Temperature Compensation of Transducers Using Semiconductor Strain Gages
Temperature compensation of transducers using semiconductor strain gages involves an understanding of the interrelationships between basic sensor performance, transducer design and compensation techniques. This paper describes some of these interrelationships and gives specific information regarding conventional temperature compensation approaches used on production hardware.
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