{"title":"纯金属与液态钠和液态锡的润湿性","authors":"Jun-ichi Saito, Y. Kobayashi, H. Shibutani","doi":"10.2320/MATERTRANS.MT-M2021107","DOIUrl":null,"url":null,"abstract":"This study aims to control the wettability of pure transition metals by liquid sodium or liquid tin. Such wettability was evaluated by measuring the contact angles with the droplet method. Pure titanium, iron, nickel, copper, and molybdenum metals were selected as specimens in this experiment. All experiments were conducted in an environment with high pure argon gas and extremely low moisture to avoid the in fl uence of oxygen on the liquid metals. The measurement temperature was just above the melting temperature of each liquid metal. Results showed that in both liquid sodium and liquid tin, the measured contact angle changed depending on the atomic number of the substrate metal. The electronic structure of the interface between a liquid metal and a substrate metal was calculated by the molecular orbital method. Simple cluster models of the interface between the liquid metal and substrate transition metal were used in this calculation. The calculation results con fi rmed that the electronic state of the interface was expressed well. The magnitude of the atomic bonding between the liquid metal and substrate metal changed in accordance with the atomic number of the substrate metal, and the magnitude of the atomic bonding between the substrate metals changed similarly. There was an evident relationship between the atomic bonding ratio and the contact angle. The atomic bonding ratio is the ratio of the liquid-metal-substrate metal-atomic bonding to the substrate metal atomic bonding. This fi nding implies that the atomic bonding a ff ected the wettability between the liquid metal and the substrate metal. The atomic bonding was obtained as one of the indications was obtained to control the wettability by liquid metal. [doi:10.2320 / matertrans.MT-M2021107] (Received","PeriodicalId":17322,"journal":{"name":"Journal of the Japan Institute of Metals and Materials","volume":"146 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2021-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Wettability of Pure Metals with Liquid Sodium and Liquid Tin\",\"authors\":\"Jun-ichi Saito, Y. Kobayashi, H. Shibutani\",\"doi\":\"10.2320/MATERTRANS.MT-M2021107\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This study aims to control the wettability of pure transition metals by liquid sodium or liquid tin. Such wettability was evaluated by measuring the contact angles with the droplet method. Pure titanium, iron, nickel, copper, and molybdenum metals were selected as specimens in this experiment. All experiments were conducted in an environment with high pure argon gas and extremely low moisture to avoid the in fl uence of oxygen on the liquid metals. The measurement temperature was just above the melting temperature of each liquid metal. Results showed that in both liquid sodium and liquid tin, the measured contact angle changed depending on the atomic number of the substrate metal. The electronic structure of the interface between a liquid metal and a substrate metal was calculated by the molecular orbital method. Simple cluster models of the interface between the liquid metal and substrate transition metal were used in this calculation. The calculation results con fi rmed that the electronic state of the interface was expressed well. The magnitude of the atomic bonding between the liquid metal and substrate metal changed in accordance with the atomic number of the substrate metal, and the magnitude of the atomic bonding between the substrate metals changed similarly. There was an evident relationship between the atomic bonding ratio and the contact angle. The atomic bonding ratio is the ratio of the liquid-metal-substrate metal-atomic bonding to the substrate metal atomic bonding. This fi nding implies that the atomic bonding a ff ected the wettability between the liquid metal and the substrate metal. The atomic bonding was obtained as one of the indications was obtained to control the wettability by liquid metal. [doi:10.2320 / matertrans.MT-M2021107] (Received\",\"PeriodicalId\":17322,\"journal\":{\"name\":\"Journal of the Japan Institute of Metals and Materials\",\"volume\":\"146 1\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-03-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of the Japan Institute of Metals and Materials\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.2320/MATERTRANS.MT-M2021107\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of the Japan Institute of Metals and Materials","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.2320/MATERTRANS.MT-M2021107","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Wettability of Pure Metals with Liquid Sodium and Liquid Tin
This study aims to control the wettability of pure transition metals by liquid sodium or liquid tin. Such wettability was evaluated by measuring the contact angles with the droplet method. Pure titanium, iron, nickel, copper, and molybdenum metals were selected as specimens in this experiment. All experiments were conducted in an environment with high pure argon gas and extremely low moisture to avoid the in fl uence of oxygen on the liquid metals. The measurement temperature was just above the melting temperature of each liquid metal. Results showed that in both liquid sodium and liquid tin, the measured contact angle changed depending on the atomic number of the substrate metal. The electronic structure of the interface between a liquid metal and a substrate metal was calculated by the molecular orbital method. Simple cluster models of the interface between the liquid metal and substrate transition metal were used in this calculation. The calculation results con fi rmed that the electronic state of the interface was expressed well. The magnitude of the atomic bonding between the liquid metal and substrate metal changed in accordance with the atomic number of the substrate metal, and the magnitude of the atomic bonding between the substrate metals changed similarly. There was an evident relationship between the atomic bonding ratio and the contact angle. The atomic bonding ratio is the ratio of the liquid-metal-substrate metal-atomic bonding to the substrate metal atomic bonding. This fi nding implies that the atomic bonding a ff ected the wettability between the liquid metal and the substrate metal. The atomic bonding was obtained as one of the indications was obtained to control the wettability by liquid metal. [doi:10.2320 / matertrans.MT-M2021107] (Received