{"title":"使用极低功耗电子器件的单片3D (M3D)可重构逻辑应用","authors":"W. Choi","doi":"10.1109/CSTIC.2017.7919753","DOIUrl":null,"url":null,"abstract":"CMOS and nano-electromechanical (NEM) hybrid reconfigurable logic (RL) circuits are implemented by using monolithic three-dimensional (M3D) integration process. Their operation and feasibility are discussed based on simulation and experimental results.","PeriodicalId":6846,"journal":{"name":"2017 China Semiconductor Technology International Conference (CSTIC)","volume":"28 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2017-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Monolithic 3D (M3D) reconfigurable logic applications using extremely-low-power electron devices\",\"authors\":\"W. Choi\",\"doi\":\"10.1109/CSTIC.2017.7919753\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"CMOS and nano-electromechanical (NEM) hybrid reconfigurable logic (RL) circuits are implemented by using monolithic three-dimensional (M3D) integration process. Their operation and feasibility are discussed based on simulation and experimental results.\",\"PeriodicalId\":6846,\"journal\":{\"name\":\"2017 China Semiconductor Technology International Conference (CSTIC)\",\"volume\":\"28 1\",\"pages\":\"1-4\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-03-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 China Semiconductor Technology International Conference (CSTIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CSTIC.2017.7919753\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 China Semiconductor Technology International Conference (CSTIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSTIC.2017.7919753","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Monolithic 3D (M3D) reconfigurable logic applications using extremely-low-power electron devices
CMOS and nano-electromechanical (NEM) hybrid reconfigurable logic (RL) circuits are implemented by using monolithic three-dimensional (M3D) integration process. Their operation and feasibility are discussed based on simulation and experimental results.
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