一种包含局部互连的逻辑自修复方案

T. Koal, Daniel Scheit, H. Vierhaus
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引用次数: 4

摘要

关于CMOS技术发展的技术预测预测,由于辐射效应,间歇性故障的水平会更高,但由于不可避免的参数变化和更高的应力因子,永久性故障的密度也会更高。为了实现高产量和长期可靠运行,在生产试验后和应用现场都能使用的内置自修复机制成为必须。本文介绍的体系结构包括逻辑自修复机制,也可以覆盖本地互连。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A scheme of logic self repair including local interconnects
Technology forecasts concerning the development of CMOS technologies predict a higher level of intermittent faults due to radiation effects, but also a higher density of permanent fault effects due to inevitable parameter shifts and higher stress factors. For high production yield and long-term dependable operation, mechanisms of built-in self repair that can be used after production test and in the field of application are becoming a must. The architecture introduced in this paper includes mechanisms for logic self repair that may also cover local interconnects.
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