用于微阵列制造的新型微点胶芯片

Baojian Xu, Zhi Qiao, Qinghui Jin, Jianlong Zhao
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引用次数: 1

摘要

提出了一种新型微点胶芯片的设计思路和制造方法。灌装过程由毛细力完成,无需额外的能量,大大降低了设计和操作的复杂性。切屑中喷嘴周围的环形间隙有助于液滴在亲水性表面上形成,通道与储液器之间的阶梯连接可以减少流体回流到入口。采用深度反应离子刻蚀(deep reactive ion etching, DRIE)技术,成功制备了25个储层的硅片。聚二甲基硅油(PDMS)膜能在150℃的真空环境下3小时内与硅表面紧密结合形成密封通道。通过施加10 kPa的压力,持续1000 μ s,芯片可以在3.4mm × 3.4mm的玻璃上同时产生5 × 5阵列。25个流体斑内强度的变异系数(CV)可达4.1%,直径的CV低至3.8%。计算流体力学(CFD)模拟和点胶实验结果表明,所制备的硅芯片可以在短时间内制备出稳定性高、重现性好的均匀微阵列
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Novel Micro Dispensing Chip for Microarray Fabrication
The paper proposes a novel design concept and fabrication method of micro dispensing chip. The filling process is performed by capillary force without extra energy, greatly reducing the complexity of design and operation. The annular interspaces around the nozzles in the chip can help the droplet formation on the hydrophilic surfaces, and the step conjunction between the channel and the reservoir can reduce the fluid refluence to the inlet. The fabrication of the silicon chip with 25 reservoirs has been successfully completed by deep reactive ion etching (DRIE). Polydimethyl silocane (PDMS) membrane can tightly bond the silicon surface to form a sealed channel in the vacuum environment at 150degC in 3 hrs. By applying 10 kPa pressure with the duration of 1000 mus, the chip could simultaneously produce 5 times 5 array on the glass within the area of 3.4mm times 3.4mm. The coefficient of variation (CV) for intensities within 25 individual fluid spots can reach 4.1% and the CV for diameters is as low as 3.8%. The results from both computational fluid dynamics (CFD) simulations and dispensing experiments demonstrated that the fabricated silicon chip can produce uniform microarrays with high stability and good reproducibility in a short time
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