TSV插片集成x波段微带滤波器的设计、制造与测量

2019 20th International Conference on Electronic Packaging Technology(ICEPT) Pub Date : 2019-08-01 DOI:10.1109/ICEPT47577.2019.245748

Yunheng Sun, Yufeng Jin, Han Cai, Shengli Ma, Liu-lin Hu, Shuwei He

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引用次数: 1

摘要

在本文中，我们提出了一种TSV中间体集成x波段微带滤波器。它设计为工作在X波段，插入损耗(IL)为2.2dB，尺寸为2.8mm×3.7mm。经过处理的样品，测量带宽(BW)约为2.33GHz，通带插入损耗约为2.2dB。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Design, fabrication and measurement of TSV interposer integrated X-band microstrip filter

In this paper, we present a TSV interposer integrated X-band microstrip filter. It designed as working at X band with an insertion loss (IL) of 2.2dB, measuring 2.8mm×3.7mm in size. With processed sample, the measured bandwidth (BW) is about 2.33GHz, the passband insertion loss is about 2.2dB.

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来源期刊

2019 20th International Conference on Electronic Packaging Technology(ICEPT)

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