{"title":"用于多层封装和pcb的有效信号和功率完整性分析的域和模态分解","authors":"E. Li, E. Liu","doi":"10.1109/MWSYM.2012.6259536","DOIUrl":null,"url":null,"abstract":"This paper systematically explores the underlying principle of a special domain and modal decomposition approach, and reports its latest advancement in modeling and simulation of multilayer packages and printed circuit boards for signal and power integrity analysis. Simulation results by different numerical techniques encompassed in the domain and modal decomposition approach are compared against those from measurement and full-wave simulation. The special domain and modal decomposition approach, compared with full-wave methods, exhibits faster simulation speed with good accuracy.","PeriodicalId":6385,"journal":{"name":"2012 IEEE/MTT-S International Microwave Symposium Digest","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2012-06-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Domain and modal decomposition for efficient signal and power integrity analysis of multilayer packages and PCBs\",\"authors\":\"E. Li, E. Liu\",\"doi\":\"10.1109/MWSYM.2012.6259536\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper systematically explores the underlying principle of a special domain and modal decomposition approach, and reports its latest advancement in modeling and simulation of multilayer packages and printed circuit boards for signal and power integrity analysis. Simulation results by different numerical techniques encompassed in the domain and modal decomposition approach are compared against those from measurement and full-wave simulation. The special domain and modal decomposition approach, compared with full-wave methods, exhibits faster simulation speed with good accuracy.\",\"PeriodicalId\":6385,\"journal\":{\"name\":\"2012 IEEE/MTT-S International Microwave Symposium Digest\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-06-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE/MTT-S International Microwave Symposium Digest\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MWSYM.2012.6259536\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE/MTT-S International Microwave Symposium Digest","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MWSYM.2012.6259536","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Domain and modal decomposition for efficient signal and power integrity analysis of multilayer packages and PCBs
This paper systematically explores the underlying principle of a special domain and modal decomposition approach, and reports its latest advancement in modeling and simulation of multilayer packages and printed circuit boards for signal and power integrity analysis. Simulation results by different numerical techniques encompassed in the domain and modal decomposition approach are compared against those from measurement and full-wave simulation. The special domain and modal decomposition approach, compared with full-wave methods, exhibits faster simulation speed with good accuracy.
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