{"title":"异构集成路线图:未来系统的驱动力和使能技术","authors":"William Chen, B. Bottoms","doi":"10.23919/VLSIT.2019.8776484","DOIUrl":null,"url":null,"abstract":"Our industry has reinvented itself through multiple disruptive changes in market, products, and technology. We are at the triple inflection point, brought about by tech company disruption, Moore's Law plateauing, and the explosive growth of the digital economy. Continued progress will require a new vision for electronic innovations. This paper shows examples of Heterogeneous Integration (SiP) for two market segments, Smart Phone and HPC Server and describes the purpose and organization of the Heterogeneous Integration Roadmap.","PeriodicalId":6752,"journal":{"name":"2019 Symposium on VLSI Technology","volume":"94 1","pages":"T50-T51"},"PeriodicalIF":0.0000,"publicationDate":"2019-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":"{\"title\":\"Heterogeneous Integration Roadmap: Driving Force and Enabling Technology for Systems of the Future\",\"authors\":\"William Chen, B. Bottoms\",\"doi\":\"10.23919/VLSIT.2019.8776484\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Our industry has reinvented itself through multiple disruptive changes in market, products, and technology. We are at the triple inflection point, brought about by tech company disruption, Moore's Law plateauing, and the explosive growth of the digital economy. Continued progress will require a new vision for electronic innovations. This paper shows examples of Heterogeneous Integration (SiP) for two market segments, Smart Phone and HPC Server and describes the purpose and organization of the Heterogeneous Integration Roadmap.\",\"PeriodicalId\":6752,\"journal\":{\"name\":\"2019 Symposium on VLSI Technology\",\"volume\":\"94 1\",\"pages\":\"T50-T51\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"14\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 Symposium on VLSI Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/VLSIT.2019.8776484\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 Symposium on VLSI Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/VLSIT.2019.8776484","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Heterogeneous Integration Roadmap: Driving Force and Enabling Technology for Systems of the Future
Our industry has reinvented itself through multiple disruptive changes in market, products, and technology. We are at the triple inflection point, brought about by tech company disruption, Moore's Law plateauing, and the explosive growth of the digital economy. Continued progress will require a new vision for electronic innovations. This paper shows examples of Heterogeneous Integration (SiP) for two market segments, Smart Phone and HPC Server and describes the purpose and organization of the Heterogeneous Integration Roadmap.
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