用于下一代成像和通信应用的300 GHz低噪声放大器S-MMIC

A. Tessmann, A. Leuther, S. Wagner, H. Massler, M. Kuri, H. Stulz, M. Zink, M. Riessle, T. Merkle
{"title":"用于下一代成像和通信应用的300 GHz低噪声放大器S-MMIC","authors":"A. Tessmann, A. Leuther, S. Wagner, H. Massler, M. Kuri, H. Stulz, M. Zink, M. Riessle, T. Merkle","doi":"10.1109/MWSYM.2017.8058687","DOIUrl":null,"url":null,"abstract":"A WR-3 (220–330 GHz) low-noise amplifier (LNA) circuit has been developed for use in next-generation high resolution imaging applications and ultra-high capacity communication links. The submillimeter-wave monolithic integrated circuit (S-MMIC) was realized by using a 35 nm InAlAs/InGaAs based metamorphic high electron mobility transistor (mHEMT) technology in combination with grounded coplanar waveguide topology (GCPW) and cascode transistors, thus leading to a very low noise figure in combination with high gain and large operational bandwidth. The packaged LNA circuit achieved a maximum gain of 29 dB at 314 GHz and more than 26 dB in the frequency range from 252 to 330 GHz. An average room temperature (T = 293 K) noise figure of 6.5 dB was measured between 280 and 330 GHz. Furthermore, the LNA circuit has been used to realize a very compact WR-3 single-chip receiver module, demonstrating an average conversion gain of 6.5 dB and a noise figure of 8.6 dB at the frequency of operation.","PeriodicalId":6481,"journal":{"name":"2017 IEEE MTT-S International Microwave Symposium (IMS)","volume":"25 4 1","pages":"760-763"},"PeriodicalIF":0.0000,"publicationDate":"2017-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"28","resultStr":"{\"title\":\"A 300 GHz low-noise amplifier S-MMIC for use in next-generation imaging and communication applications\",\"authors\":\"A. Tessmann, A. Leuther, S. Wagner, H. Massler, M. Kuri, H. Stulz, M. Zink, M. Riessle, T. Merkle\",\"doi\":\"10.1109/MWSYM.2017.8058687\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A WR-3 (220–330 GHz) low-noise amplifier (LNA) circuit has been developed for use in next-generation high resolution imaging applications and ultra-high capacity communication links. The submillimeter-wave monolithic integrated circuit (S-MMIC) was realized by using a 35 nm InAlAs/InGaAs based metamorphic high electron mobility transistor (mHEMT) technology in combination with grounded coplanar waveguide topology (GCPW) and cascode transistors, thus leading to a very low noise figure in combination with high gain and large operational bandwidth. The packaged LNA circuit achieved a maximum gain of 29 dB at 314 GHz and more than 26 dB in the frequency range from 252 to 330 GHz. An average room temperature (T = 293 K) noise figure of 6.5 dB was measured between 280 and 330 GHz. Furthermore, the LNA circuit has been used to realize a very compact WR-3 single-chip receiver module, demonstrating an average conversion gain of 6.5 dB and a noise figure of 8.6 dB at the frequency of operation.\",\"PeriodicalId\":6481,\"journal\":{\"name\":\"2017 IEEE MTT-S International Microwave Symposium (IMS)\",\"volume\":\"25 4 1\",\"pages\":\"760-763\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"28\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE MTT-S International Microwave Symposium (IMS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MWSYM.2017.8058687\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE MTT-S International Microwave Symposium (IMS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MWSYM.2017.8058687","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 28

摘要

WR-3 (220-330 GHz)低噪声放大器(LNA)电路已开发用于下一代高分辨率成像应用和超高容量通信链路。亚毫米波单片集成电路(S-MMIC)采用35nm基于InAlAs/InGaAs的高电子迁移率晶体管(mHEMT)技术,结合接地共面波导拓扑结构(GCPW)和级联晶体管,实现了低噪声、高增益和大工作带宽。封装的LNA电路在314 GHz时的最大增益为29 dB,在252至330 GHz的频率范围内的最大增益超过26 dB。在280 ~ 330 GHz范围内测得平均室温(T = 293 K)噪声系数为6.5 dB。此外,LNA电路已用于实现非常紧凑的WR-3单片机接收模块,在工作频率下平均转换增益为6.5 dB,噪声系数为8.6 dB。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A 300 GHz low-noise amplifier S-MMIC for use in next-generation imaging and communication applications
A WR-3 (220–330 GHz) low-noise amplifier (LNA) circuit has been developed for use in next-generation high resolution imaging applications and ultra-high capacity communication links. The submillimeter-wave monolithic integrated circuit (S-MMIC) was realized by using a 35 nm InAlAs/InGaAs based metamorphic high electron mobility transistor (mHEMT) technology in combination with grounded coplanar waveguide topology (GCPW) and cascode transistors, thus leading to a very low noise figure in combination with high gain and large operational bandwidth. The packaged LNA circuit achieved a maximum gain of 29 dB at 314 GHz and more than 26 dB in the frequency range from 252 to 330 GHz. An average room temperature (T = 293 K) noise figure of 6.5 dB was measured between 280 and 330 GHz. Furthermore, the LNA circuit has been used to realize a very compact WR-3 single-chip receiver module, demonstrating an average conversion gain of 6.5 dB and a noise figure of 8.6 dB at the frequency of operation.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信