Cu-Al-Mn形状记忆合金薄片晶粒生长和拉伸循环对阻尼性能影响的研究进展

Dusan Milosavljevic, N. Lecis, S. Cinquemani
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摘要

最新的研究表明,Cu-Al-Mn SMA中相对晶粒尺寸的增加导致阻尼和SME性能的改善。基于这些知识,本文的作者试图了解是否有可能在Cu-Al-Mn合金中利用这些改进,特别是以薄片的形式。对Cu-Al-Mn形状记忆合金的铸态铸锭进行了一系列的热处理,以获得具有高相对晶粒尺寸值的薄片。此外,为了SMA“训练”的目的,Cu-Al-Mn板的样品进行了拉伸循环。通过光学显微镜研究了不同处理对合金组织的影响。此外,利用动态力学分析(DMA)对相变和阻尼行为进行了研究。本文介绍了研究方法和初步结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Progress on the study of grain growth and tensile cycling effects on the damping performance in Cu-Al-Mn shape memory alloy thin sheets
State-of-the-art research shows that an increase in relative grain size in Cu-Al-Mn SMA leads to improved damping and SME performance. Building on that knowledge, the authors of this paper seek to understand if it is possible to exploit these improvements within a Cu-Al-Mn alloy, specifically, in the form of thin sheets. A series of thermomechanical treatments were applied to as-cast ingots of a Cu-Al-Mn shape memory alloy with the goal of obtaining thin sheets characterized by a high value of relative grain size. Additionally, samples of Cu-Al-Mn sheets were subjected to tensile cycling for the purpose of SMA “training”. Through optical microscopy, the authors of this paper investigated the effects of the applied treatments on the alloy structure. Furthermore, the phase transformation and damping behavior were studied using dynamic mechanical analysis (DMA). Methodology and preliminary results are presented in this paper.
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