设计和制造技术的融合,是推动“一带一路”一体化的关键因素

A. Jerraya
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引用次数: 0

摘要

过去十年以HW-SW融合为主导,设计师学会了将硬件和软件设计结合起来,以应对不断增长的低成本和高性能需求。未来十年将以设计技术(硬件和软件)与制造技术的融合为主导。事实上,越来越多的设计需要深入了解技术特性才能达到所需的性能。另一方面,设计技术越来越多地用于克服制造工艺缺陷和提高良率。本讲座将首先介绍HW-SW融合和SoC设计方面的成就。然后,它将解决制造技术的趋势和挑战,以应对这种融合。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Convergence of design and fabrication technologies, a key enabler for HW-SW integration
The last decade was dominated by HW-SW convergence where designers learned to combine hardware and software design to cope with the increased demand of lower cost and increased performances. This starting decade will be dominated by the convergence between design technology (HW and SW) and fabrication technologies. In fact more and more designs require a deep knowledge of technology characteristics to reach the required performances. On the other side, design technologies are more and more used to overcome fabrication process imperfection and to improve yield. This talk will first explain the achievements in HW-SW convergence and SoC design. Then, it will address the fabrication technology trends and challenges to deal with this convergence.
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