{"title":"电子线路板先进层的实验性能分析","authors":"Steffen Klarmann, Y. Vagapov, H. Gotzig","doi":"10.1109/UPEC.2019.8893441","DOIUrl":null,"url":null,"abstract":"This paper provides an experimental performance analysis of advanced layers for electronic circuit boards. The base material of the advanced layers used in the experiments is Al-5052, with the dimensions of 100mm x 20mm x 1mm. As insulating material between the base and conductor, two aluminium coatings were investigated and the surface structure and thermal conductivity of the coatings were examined. Furthermore, three electroconductive adhesives were applied onto the coatings. Initially, electrical performance is investigated and electrical components were applied onto the new surface structure. Finally, the environmental tests were performed to determine the robustness of the evaluated system.","PeriodicalId":6670,"journal":{"name":"2019 54th International Universities Power Engineering Conference (UPEC)","volume":"1 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2019-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Experimental Performance Analysis of Advanced Layers for Electronic Circuit Boards\",\"authors\":\"Steffen Klarmann, Y. Vagapov, H. Gotzig\",\"doi\":\"10.1109/UPEC.2019.8893441\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper provides an experimental performance analysis of advanced layers for electronic circuit boards. The base material of the advanced layers used in the experiments is Al-5052, with the dimensions of 100mm x 20mm x 1mm. As insulating material between the base and conductor, two aluminium coatings were investigated and the surface structure and thermal conductivity of the coatings were examined. Furthermore, three electroconductive adhesives were applied onto the coatings. Initially, electrical performance is investigated and electrical components were applied onto the new surface structure. Finally, the environmental tests were performed to determine the robustness of the evaluated system.\",\"PeriodicalId\":6670,\"journal\":{\"name\":\"2019 54th International Universities Power Engineering Conference (UPEC)\",\"volume\":\"1 1\",\"pages\":\"1-4\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-11-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 54th International Universities Power Engineering Conference (UPEC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/UPEC.2019.8893441\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 54th International Universities Power Engineering Conference (UPEC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/UPEC.2019.8893441","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Experimental Performance Analysis of Advanced Layers for Electronic Circuit Boards
This paper provides an experimental performance analysis of advanced layers for electronic circuit boards. The base material of the advanced layers used in the experiments is Al-5052, with the dimensions of 100mm x 20mm x 1mm. As insulating material between the base and conductor, two aluminium coatings were investigated and the surface structure and thermal conductivity of the coatings were examined. Furthermore, three electroconductive adhesives were applied onto the coatings. Initially, electrical performance is investigated and electrical components were applied onto the new surface structure. Finally, the environmental tests were performed to determine the robustness of the evaluated system.