{"title":"用碱性络合剂蚀刻系统消除硅丘","authors":"Carmen Moldovan, Rodica Iosub, Mircea Modreanu","doi":"10.1016/S1466-6049(01)00117-9","DOIUrl":null,"url":null,"abstract":"<div><p>This paper presents the results obtained in silicon hillock elimination using alkaline solutions: KOH, NaOH, LiOH·H<sub>2</sub>O with an added complexant. The added complexant in alkaline solutions is azocalix[4]arene. The alkaline solutions were compared and analysed with and without added complexant for their effect on hillocks. The behaviour of these solutions is explained using the theory of molar conductivity. The results show that use of the complexant permits control of the etching process, yielding a smooth silicon surface, almost free of hillocks. A comparison between the alkaline etchants (KOH, NaOH, LiOH·H<sub>2</sub>O) is made and the influence of the cations in silicon etching process is explained.</p></div>","PeriodicalId":100700,"journal":{"name":"International Journal of Inorganic Materials","volume":"3 8","pages":"Pages 1173-1176"},"PeriodicalIF":0.0000,"publicationDate":"2001-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/S1466-6049(01)00117-9","citationCount":"5","resultStr":"{\"title\":\"Elimination of silicon hillocks using an alkaline complexant etching system\",\"authors\":\"Carmen Moldovan, Rodica Iosub, Mircea Modreanu\",\"doi\":\"10.1016/S1466-6049(01)00117-9\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>This paper presents the results obtained in silicon hillock elimination using alkaline solutions: KOH, NaOH, LiOH·H<sub>2</sub>O with an added complexant. The added complexant in alkaline solutions is azocalix[4]arene. The alkaline solutions were compared and analysed with and without added complexant for their effect on hillocks. The behaviour of these solutions is explained using the theory of molar conductivity. The results show that use of the complexant permits control of the etching process, yielding a smooth silicon surface, almost free of hillocks. A comparison between the alkaline etchants (KOH, NaOH, LiOH·H<sub>2</sub>O) is made and the influence of the cations in silicon etching process is explained.</p></div>\",\"PeriodicalId\":100700,\"journal\":{\"name\":\"International Journal of Inorganic Materials\",\"volume\":\"3 8\",\"pages\":\"Pages 1173-1176\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://sci-hub-pdf.com/10.1016/S1466-6049(01)00117-9\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Journal of Inorganic Materials\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1466604901001179\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Inorganic Materials","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1466604901001179","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Elimination of silicon hillocks using an alkaline complexant etching system
This paper presents the results obtained in silicon hillock elimination using alkaline solutions: KOH, NaOH, LiOH·H2O with an added complexant. The added complexant in alkaline solutions is azocalix[4]arene. The alkaline solutions were compared and analysed with and without added complexant for their effect on hillocks. The behaviour of these solutions is explained using the theory of molar conductivity. The results show that use of the complexant permits control of the etching process, yielding a smooth silicon surface, almost free of hillocks. A comparison between the alkaline etchants (KOH, NaOH, LiOH·H2O) is made and the influence of the cations in silicon etching process is explained.
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