M. Bertrand, Em Pistone, G. Acri, D. Kaddour, F. Podevin, V. Puyal, S. Wipf, C. Wipf, M. Wietstruck, M. Kaynak, P. Ferrari
{"title":"毫米波功能化硅中间层的衬底集成波导","authors":"M. Bertrand, Em Pistone, G. Acri, D. Kaddour, F. Podevin, V. Puyal, S. Wipf, C. Wipf, M. Wietstruck, M. Kaynak, P. Ferrari","doi":"10.1109/MWSYM.2018.8439287","DOIUrl":null,"url":null,"abstract":"This paper presents D-band mm-wave SIWs, which are embedded in a high-resistivity silicon interposer. Thanks to the interposer thickness equal to $\\pmb{70\\ \\mu} \\mathbf{m}$, high-performance SIW were obtained, with measured attenuation constant between 0.4 and 0.6 dB/mm from 110 GHz to 170 GHz. These first results pave the way for the realization of high performance passive circuits and antennas embedded in the interposer. Also, by using a fully shielded waveguide highly insensitive to adj acent wave-guiding and radiating structures, this topology provides significant advantages for packaging solutions at mm-wave frequencies. Such a functionalized interposer could offer lower cost, higher electrical performance as compared to standard CMOS technologies.","PeriodicalId":6675,"journal":{"name":"2018 IEEE/MTT-S International Microwave Symposium - IMS","volume":"96 1","pages":"875-878"},"PeriodicalIF":0.0000,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"18","resultStr":"{\"title\":\"Substrate Integrated Waveguides for mm-wave Functionalized Silicon Interposer\",\"authors\":\"M. Bertrand, Em Pistone, G. Acri, D. Kaddour, F. Podevin, V. Puyal, S. Wipf, C. Wipf, M. Wietstruck, M. Kaynak, P. Ferrari\",\"doi\":\"10.1109/MWSYM.2018.8439287\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents D-band mm-wave SIWs, which are embedded in a high-resistivity silicon interposer. Thanks to the interposer thickness equal to $\\\\pmb{70\\\\ \\\\mu} \\\\mathbf{m}$, high-performance SIW were obtained, with measured attenuation constant between 0.4 and 0.6 dB/mm from 110 GHz to 170 GHz. These first results pave the way for the realization of high performance passive circuits and antennas embedded in the interposer. Also, by using a fully shielded waveguide highly insensitive to adj acent wave-guiding and radiating structures, this topology provides significant advantages for packaging solutions at mm-wave frequencies. Such a functionalized interposer could offer lower cost, higher electrical performance as compared to standard CMOS technologies.\",\"PeriodicalId\":6675,\"journal\":{\"name\":\"2018 IEEE/MTT-S International Microwave Symposium - IMS\",\"volume\":\"96 1\",\"pages\":\"875-878\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"18\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE/MTT-S International Microwave Symposium - IMS\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MWSYM.2018.8439287\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE/MTT-S International Microwave Symposium - IMS","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MWSYM.2018.8439287","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Substrate Integrated Waveguides for mm-wave Functionalized Silicon Interposer
This paper presents D-band mm-wave SIWs, which are embedded in a high-resistivity silicon interposer. Thanks to the interposer thickness equal to $\pmb{70\ \mu} \mathbf{m}$, high-performance SIW were obtained, with measured attenuation constant between 0.4 and 0.6 dB/mm from 110 GHz to 170 GHz. These first results pave the way for the realization of high performance passive circuits and antennas embedded in the interposer. Also, by using a fully shielded waveguide highly insensitive to adj acent wave-guiding and radiating structures, this topology provides significant advantages for packaging solutions at mm-wave frequencies. Such a functionalized interposer could offer lower cost, higher electrical performance as compared to standard CMOS technologies.