TiO2薄膜的反应离子刻蚀:不同气体的影响

R. Adzhri, M. Arshad, M. Fathil, U. Hashim, A. R. Ruslinda, R. M. Ayub, S. Gopinath, C. Voon, K. L. Foo, M. Nuzaihan, A. H. Azman, M. Zaki
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引用次数: 6

摘要

二氧化钛(TiO2)是一类在生物传感器中具有广阔应用前景的金属氧化物材料。二氧化钛具有物理和化学抗性,可以延长设备的使用寿命。然而,具有高选择性的TiO2蚀刻是一个具有挑战性的过程,特别是在纳米尺度上获得良好的和期望的轮廓。在这项工作中,我们提出了各向异性蚀刻轮廓。采用了三种ICP-RIE配方:CF4/O2、Ar/SF6和CF4/Ar。在此之前,TiO2溶胶凝胶沉积在SiO2层的顶部。利用三维表面轮廓仪和原子力显微镜(AFM)对所有结果进行光学和物理表征,最后进行电学表征。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Reactive Ion etching of TiO2 thin film: The impact of different gaseous
Titanium dioxide (TiO2) is one of a metal oxide material group that shows a promising future in biosensors application. TiO2 possess both physical and chemical resistant that can extend a device lifespan. However, etching of TiO2 with very high selectivity is a challenging process in achieving good and desired profile particularly in nanometer scale. In this work, we present the anisotropic etch profile. Three types of ICP-RIE recipes are used i.e. CF4/O2, Ar/SF6 and CF4/Ar. Prior to that, the TiO2 sol-gel is deposited on top of SiO2 layer. All the results are optically and physically characterized by using 3D-surface profilometer and atomic force microscopy (AFM) and finally followed by electrical characterization.
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