{"title":"铝表面镍的热致界面粘结破坏","authors":"L. Révay","doi":"10.1016/0300-9416(75)90006-1","DOIUrl":null,"url":null,"abstract":"<div><p>Annealing in the range 225–550 °C increases the bonding forces between Ni-Al couples. Compressive stresses arise in nickel deposits owing to the different thermal expansion. However, the increase of annealing time reduces the stress level until bond failure initiates. The apparent bonding energy is estimated as 0.7 eV.</p></div>","PeriodicalId":100399,"journal":{"name":"Electrodeposition and Surface Treatment","volume":"3 4","pages":"Pages 283-288"},"PeriodicalIF":0.0000,"publicationDate":"1975-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/0300-9416(75)90006-1","citationCount":"1","resultStr":"{\"title\":\"Thermally induced interface bond failure of nickel deposited on aluminium\",\"authors\":\"L. Révay\",\"doi\":\"10.1016/0300-9416(75)90006-1\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Annealing in the range 225–550 °C increases the bonding forces between Ni-Al couples. Compressive stresses arise in nickel deposits owing to the different thermal expansion. However, the increase of annealing time reduces the stress level until bond failure initiates. The apparent bonding energy is estimated as 0.7 eV.</p></div>\",\"PeriodicalId\":100399,\"journal\":{\"name\":\"Electrodeposition and Surface Treatment\",\"volume\":\"3 4\",\"pages\":\"Pages 283-288\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1975-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://sci-hub-pdf.com/10.1016/0300-9416(75)90006-1\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrodeposition and Surface Treatment\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/0300941675900061\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrodeposition and Surface Treatment","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/0300941675900061","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thermally induced interface bond failure of nickel deposited on aluminium
Annealing in the range 225–550 °C increases the bonding forces between Ni-Al couples. Compressive stresses arise in nickel deposits owing to the different thermal expansion. However, the increase of annealing time reduces the stress level until bond failure initiates. The apparent bonding energy is estimated as 0.7 eV.
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