叠片天线封装的可行性研究

A. Hamidipour, A. Fischer, L. Maurer, A. Stelzer
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引用次数: 4

摘要

本文研究了一种利用堆叠指向器增强封装天线增益技术的可行性。为汽车雷达应用设计的77 ghz天线和频率乘法器集成在6×6mm2嵌入式晶圆级球栅阵列(eWLB)封装中。该倍频器产生其输入信号的第十八次谐波,并允许使用商业信号源来表征天线。寄生导演通过光刻技术蚀刻在低损耗2.54mm厚RT/duroid 5880 LZ层压板上,并安装在eWLB封装上。理论分析和全电磁仿真与天线辐射波束方向图的实际测量结果进行了对比验证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
On the feasibility of an antenna in package with stacked directors
This paper investigates the feasibility of a gain enhancement technique using stacked directors for antennas in package. A 77-GHz antenna designed for automotive radar applications and a frequency multiplier were integrated in a 6×6mm2 embedded wafer level ball grid array (eWLB) package. The frequency multiplier generates the eighteenth harmonic of its input signal and allows the use of a commercial signal source to characterize the antenna. Parasitic directors were etched on a low-loss 2.54mm thick RT/duroid 5880 LZ laminate by means of photolithography and were mounted on the eWLB package. Theoretical analysis and full electromagnetic simulations were verified against the actual measurements of the antenna radiation beam pattern.
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