氮化硼提高环氧体系击穿强度和导热性能的研究

M. Reading, Alun Vaughan, Paul Lewin
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引用次数: 29

摘要

以前已经看到,在主体材料系统中添加填料可以创建具有优越性能的复合材料。特别是聚合物已被证明是这种性能增强填料的良好载体。这项研究着眼于这样一种基于聚合物的纳米复合材料,目的是生产一种导热高压绝缘体。由于其良好的初始机械和电气性能,选择了标准的热固性环氧树脂体系和硬化剂作为主体聚合物。该系统以前也成功地用于承载其他填料。填料选择氮化硼粉末,因为它声称具有良好的绝缘性能和高导热性。对氮化硼的不同粒径和聚集状态进行了测试,希望填料的成功分散不仅能提高材料的击穿强度,还能提高材料的导热性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An investigation into improving the breakdown strength and thermal conduction of an epoxy system using boron nitride
It has been seen previously that addition of fillers to host material systems can create composites with superior properties. In particular polymers have been shown to be good hosts for such property-boosting fillers. This investigation looks at such a polymer based nanocomposite, with the aim to produce a thermally conductive high voltage insulator. A standard thermosetting epoxy system and hardener were chosen to act as the host polymer due to its good initial mechanical and electrical properties. This system has also been successfully used previously to host other fillers. The filler chosen was boron nitride powder, due to its claim of having good insulation properties and high thermal conductivity. Several different sizes and aggregation states of boron nitride were tested and it was hoped that successful dispersion of the fillers would not only increase the breakdown strength of the material, but also the thermal conductivity.
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