大规模高深度三维扫描测量系统及算法优化。

Fan Zhang, ZhenYang Li, Liansheng Zhang, R. Cheng, Qiangxian Huang, Ruijun Li, Chao-qun Wang
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引用次数: 0

摘要

轻拍扫描是纳米尺度表面形貌测量的一种重要方法。它可以消除侧向力,减少对被测样品的损伤,因此被广泛使用。目前的扫描探针显微镜存在测量范围小、z向测量能力弱的局限性,研究大范围、高深宽比的三维扫描技术具有重要的实际意义和工程应用价值。本文利用石英音叉的高频共振,结合钨丝触针。它具有测量大长宽比微器件表面轮廓的能力。所提出的三维扫描测量系统实现了深度为~ 58µm的微观结构测量。整个测量范围为400 × 400 × 400µm3,垂直分辨率达到0.28 nm。该系统能够准确获取微流控生物芯片的三维表面形貌。此外,提出了一种基于扫描过程误差和低扫描效率的滑动窗口算法。与逐点扫描算法相比,所提出的SWA算法将三维轮廓残差平方均值降低了7.70%,从而验证了算法的可行性。该三维扫描测量系统和丝锥模式下的算法为大纵横比微结构的三维形貌测量提供了重要的参考。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Large-scale and high-depth three dimensional scanning measurement system and algorithm optimization.
Tapping scanning mode is an important method for measuring surface topography at the nanometer scale. It is widely used because it can eliminate lateral force and reduce damage to the tested sample. Research on three dimensional (3D) scanning technology with a large range and high depth-to-width ratio has important practical significance and engineering application value because the current scanning probe microscope has the limitations of small measurement ranges and weak Z-direction measurement ability. The high-frequency resonance of the quartz tuning fork, combined with the tungsten stylus, is used in this paper. It has the ability to measure the surface profile of the microdevice with a large aspect ratio. The proposed 3D scanning measurement system has realized a microstructure measurement with a depth of ∼58 µm. The entire measuring range is 400 × 400 × 400 µm3, and the vertical resolution reaches 0.28 nm. The system can accurately obtain the 3D surface topography of the microfluidic biochip. In addition, a sliding window algorithm (SWA) based on errors in the scanning process and low scanning efficiency is proposed. Compared with the point-by-line scanning algorithm, the proposed SWA reduces the mean value of the squared residuals of the 3D profile by 7.70%, thereby verifying the feasibility of the algorithm. The 3D scanning measurement system and the algorithm in the tap mode provide an important reference for the 3D topography measurement of microstructures with large aspect ratios.
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