高速CMOS SRAM的折叠位线架构

Sejun Kim, I. Chang, S. Seo, K. Kwack
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引用次数: 0

摘要

本文介绍了一种高速SRAM的结构和方案。总结如下:1)折叠位线架构(FBLA)通过减小寄生电容来减小位线的延迟时间,从而减小面积。2)采用双字线激活(DWLA)技术,使数据速率提高两倍,并使行路径延迟最小化;3)采用高速传感方案,减少感测放大器的延迟时间。为了验证上述,采用0.6 /spl mu/m CMOS技术设计了一个8 kb的SRAM。实现了600 Mbyte/s(300 M/spl倍/8/spl倍/2)的数据速率,芯片尺寸为2.8 mm/spl倍/0.85 mm。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A folded bit-line architecture for high speed CMOS SRAM
This paper describes a new architecture and schemes for a high speed SRAM. It is summarized as follows:1) a Folded Bit-Line Architecture (FBLA) to reduce the delay time of bit-line by decreasing the parastic capacitance, to reduce the area. 2) a Double Word-Line Activation (DWLA) technique to increase the data-rate twice and minimize row path delay, and 3) a high speed sensing scheme to decrease the delay time of the sense amplifier. To verify the above, a 8 kb SRAM was designed using 0.6 /spl mu/m CMOS technology. It realized a 600 Mbyte/s(300 M/spl times/8/spl times/2) data-rate and the die size is 2.8 mm/spl times/0.85 mm.
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