Cu-Co-Si-Ti复合强化合金的优异力学性能和高导电性

Y. Geng, Yijie Ban, Xu Li, Yi Zhang, K. Song, Yanlin Jia, B. Tian, Meng Zhou, Yong Liu, A. Volinsky
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引用次数: 15

摘要

高性能铜合金因其高导电性和优异的力学性能,在电气、电子、航空航天等领域得到了广泛的应用。在目前的工作中,我们提出了一类新的Cu-Co-Si-Ti合金,通过加入多种合金元素,在热处理过程中产生多重强化。采用50%冷轧、500℃时效30 min的最佳工艺,获得了固溶强化、变形强化和双纳米沉淀强化,获得了优异的抗拉强度(617.9 MPa)和高电导率(41.7% IACS)的Cu-Co-Si-Ti合金。此外,还发现Goss、Brass、copper和S织构的体积分数与力学性能密切相关。与多种强化机制的贡献相比,Co2Si和Cu4Ti的纳米沉淀对双纳米沉淀强化的贡献更大。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Excellent Mechanical Properties and High Electrical Conductivity of Cu-Co-Si-Ti Alloy Due to Multiple Strengthening
High performance copper alloys are widely used in electrical, electronic, aerospace fields welcomed due to their high electrical conductivity and excellent mechanical properties. At present work, we proposed a new class of Cu-Co-Si-Ti alloy by incorporating the multiple alloying elements, resulting in the multiple strengthening during heat treatment. The achievement of solution strengthening, deformation strengthening and dual-nanoprecipitation strengthening leaded to the Cu-Co-Si-Ti alloy with excellent tensile strength (617.9 MPa) and high electrical conductivity (41.7% IACS) by the optimum process of 50% cold rolling and aging at 500 °C for 30 min. EBSD was used to analyze the microstructure and texture evolution during the aging process. Moreover, it was found that the volume fraction of Goss, Brass, copper and S texture had close connections with the mechanical properties. By comparing with the contributions of multiple strengthening mechanisms, dual-nanoprecipitation strengthening contributed quite a lot due to the nanoprecipitation of Co2Si and Cu4Ti.
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