双射流膜冷却孔、圆柱孔和扇形孔的综合性能比较

IF 2.8 4区 工程技术 Q2 ENGINEERING, MECHANICAL
Jiang Lei, Jiaxu Yao, Jianhong He, Xi Yang, Kecheng Zhang, Lesley Wright
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引用次数: 0

摘要

本文采用实验和数值方法研究了不同形状的膜孔,包括双射流膜冷却孔(DJFC)、流向圆柱孔和扇形孔的膜冷却效率和传热系数。结果表明,当吹气比小于1.0时,DJFC孔的孔径最大。h值最高,净热通量减少值(NHFR)最高。而吹气比越高(>1.0),DJFC孔NHFR下降越快。非对称反肾涡和高湍流动能(TKE)是影响DJFC孔性能的主要因素。由于效率中等,换热系数最低,在M=2.0时,扇形孔的净热流减少量最大,尽管M=2.0为负值。较弱的肾涡和较低的TKE可以解释这一现象。圆柱孔有最低的?由于肾涡和相对较高的TKE, NHFR最低。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Comparisons of Overall Performance among Double-jet Film Cooling Holes, Cylinder holes, and Fan-shaped holes
In this paper, the film-cooling effectiveness (?) and heat transfer coefficient (h) of different film hole geometries are investigated, including double-jet film cooling (DJFC) holes, streamwise cylindrical holes, and fan-shaped holes, both experimentally and numerically. Results reveal that when the blowing ratio is less than 1.0, the DJFC holes have the highest ? and the highest h, as well as the highest net heat flux reduction (NHFR). However, a higher blowing ratio (>1.0) leads to a quickly decreasing NHFR of DJFC holes. The asymmetric anti-kidney vortex and the high turbulent kinetic energy (TKE) are dominant in the performance of the DJFC holes. Owing to medium effectiveness and the lowest heat transfer coefficient, the fan-shaped holes possess the highest net heat flux reduction at M=2.0 although the value is negative. The relatively weak kidney vortex and the low TKE can explain the phenomena. The cylindrical holes have the lowest ? and the lowest NHFR due to the kidney vortex and relatively higher TKE.
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来源期刊
自引率
0.00%
发文量
182
审稿时长
4.7 months
期刊介绍: Topical areas including, but not limited to: Biological heat and mass transfer; Combustion and reactive flows; Conduction; Electronic and photonic cooling; Evaporation, boiling, and condensation; Experimental techniques; Forced convection; Heat exchanger fundamentals; Heat transfer enhancement; Combined heat and mass transfer; Heat transfer in manufacturing; Jets, wakes, and impingement cooling; Melting and solidification; Microscale and nanoscale heat and mass transfer; Natural and mixed convection; Porous media; Radiative heat transfer; Thermal systems; Two-phase flow and heat transfer. Such topical areas may be seen in: Aerospace; The environment; Gas turbines; Biotechnology; Electronic and photonic processes and equipment; Energy systems, Fire and combustion, heat pipes, manufacturing and materials processing, low temperature and arctic region heat transfer; Refrigeration and air conditioning; Homeland security systems; Multi-phase processes; Microscale and nanoscale devices and processes.
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