利用天线实现片上互连的可行性

ICCAD. IEEE/ACM International Conference on Computer-Aided Design Pub Date : 2005-05-31 DOI:10.1109/ICCAD.2005.1560204

K. O. Kenneth, Kihong Kim, B. Floyd, J. Mehta, H. Yoon, Chih-Ming Hung, D. Bravo, T. Dickson, Xiaoling Guo, Ran Li, N. Trichy, J. Caserta, W. Bomstad, J. Branch, Dong-Jun Yang, J. Bohorquez, Jie Chen, Eunyoung Seok, L. Gao, A. Sugavanam, Jau-Jr Lin, S. Yu, C. Cao, M. Hwang, Y.-R. Ding, S.-H. Hwang, Hsin-Ta Wu, N. Zhang, J. Brewer

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引用次数: 3

摘要

在代工数字CMOS技术中集成天线和所需电路形成无线互连的可行性已经被证明。关键的挑战包括与集成电路相关的金属结构的影响、散热、封装以及收发信号与附近电路的相互作用似乎是可控的。此外，在片内互连方面，该技术可应用于实现真正的单片无线电和雷达、片间通信系统、RFID标签等。

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The feasibility of on-chip interconnection using antennas

The feasibility of integrating antennas and required circuits to form wireless interconnects in foundry digital CMOS technologies has been demonstrated. The key challenges including the effects of metal structures associated with integrated circuits, heat removal, packaging, and interaction of transmitted and received signals with nearby circuits appear to be manageable. Besides, on-chip interconnection, this technology can potentially be applied for implementation of true single chip radio and radar, interchip communication systems, RFID tags and others.

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ICCAD. IEEE/ACM International Conference on Computer-Aided Design

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