{"title":"依赖于电迁移的参数产率估计","authors":"R. Barsky, I. Wagner","doi":"10.1109/ICECS.2004.1399629","DOIUrl":null,"url":null,"abstract":"We define and investigate the problem of electromigration faults caused by spot defects during the VLSI manufacturing process. Analysis is given for a simple layout, and simulations are presented and discussed for a more complicated case. It is shown that in some cases, electromigration-dependent parametric faults can make a significant contribution to the total yield estimation.","PeriodicalId":38467,"journal":{"name":"Giornale di Storia Costituzionale","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2004-12-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"Electromigration-dependent parametric yield estimation\",\"authors\":\"R. Barsky, I. Wagner\",\"doi\":\"10.1109/ICECS.2004.1399629\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We define and investigate the problem of electromigration faults caused by spot defects during the VLSI manufacturing process. Analysis is given for a simple layout, and simulations are presented and discussed for a more complicated case. It is shown that in some cases, electromigration-dependent parametric faults can make a significant contribution to the total yield estimation.\",\"PeriodicalId\":38467,\"journal\":{\"name\":\"Giornale di Storia Costituzionale\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-12-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Giornale di Storia Costituzionale\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICECS.2004.1399629\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"Arts and Humanities\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Giornale di Storia Costituzionale","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICECS.2004.1399629","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"Arts and Humanities","Score":null,"Total":0}
We define and investigate the problem of electromigration faults caused by spot defects during the VLSI manufacturing process. Analysis is given for a simple layout, and simulations are presented and discussed for a more complicated case. It is shown that in some cases, electromigration-dependent parametric faults can make a significant contribution to the total yield estimation.
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