{"title":"基于HFSS的衬底集成波导结构参数对s参数的影响","authors":"Yuxiang Fu, Chunyue Huang, Chao Gao, Ying Liang","doi":"10.1109/ICEPT47577.2019.245793","DOIUrl":null,"url":null,"abstract":"Substrate integrated waveguides (SIW) are widely used in high-speed interconnection technology and it realize high rate data transmission. In this paper, the software of HFSS is used for modeling and simulation of SIW, and the influence of SIW structure parameters on S-parameter is analyzed. Through orthogonal experimental, the main factors which affect S-parameter are obtained. The results show that S11 increases with the increase of the diameter d of the metal through-hole. S11 increases with the increase of metal through hole spacing; S11 decreases with the increase of width of SIW. Metal through hole spacing has a significant influence on S-parameter (S11), which is the main factor affecting s-parameter (S11).","PeriodicalId":6676,"journal":{"name":"2019 20th International Conference on Electronic Packaging Technology(ICEPT)","volume":"4 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Effect of Structural Parameters of Substrate Integrated Waveguide on S-parameter Based on HFSS\",\"authors\":\"Yuxiang Fu, Chunyue Huang, Chao Gao, Ying Liang\",\"doi\":\"10.1109/ICEPT47577.2019.245793\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Substrate integrated waveguides (SIW) are widely used in high-speed interconnection technology and it realize high rate data transmission. In this paper, the software of HFSS is used for modeling and simulation of SIW, and the influence of SIW structure parameters on S-parameter is analyzed. Through orthogonal experimental, the main factors which affect S-parameter are obtained. The results show that S11 increases with the increase of the diameter d of the metal through-hole. S11 increases with the increase of metal through hole spacing; S11 decreases with the increase of width of SIW. Metal through hole spacing has a significant influence on S-parameter (S11), which is the main factor affecting s-parameter (S11).\",\"PeriodicalId\":6676,\"journal\":{\"name\":\"2019 20th International Conference on Electronic Packaging Technology(ICEPT)\",\"volume\":\"4 1\",\"pages\":\"1-4\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 20th International Conference on Electronic Packaging Technology(ICEPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT47577.2019.245793\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 20th International Conference on Electronic Packaging Technology(ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT47577.2019.245793","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Effect of Structural Parameters of Substrate Integrated Waveguide on S-parameter Based on HFSS
Substrate integrated waveguides (SIW) are widely used in high-speed interconnection technology and it realize high rate data transmission. In this paper, the software of HFSS is used for modeling and simulation of SIW, and the influence of SIW structure parameters on S-parameter is analyzed. Through orthogonal experimental, the main factors which affect S-parameter are obtained. The results show that S11 increases with the increase of the diameter d of the metal through-hole. S11 increases with the increase of metal through hole spacing; S11 decreases with the increase of width of SIW. Metal through hole spacing has a significant influence on S-parameter (S11), which is the main factor affecting s-parameter (S11).
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