{"title":"SOI积累模式三栅极LDMOS的电热特性研究","authors":"Zhangjun Shi, Xiaojin Li, Yabin Sun, Yanling Shi","doi":"10.1109/ICICM54364.2021.9660247","DOIUrl":null,"url":null,"abstract":"An electro-thermal co-optimization has been carried out on silicon-on-insulator (SOI) accumulation mode tri-gate (ATG) LDMOS by TCAD simulation. Internal electric field, temperature distribution, critical heat removal path and the thermal resistance of SOI-ATG LDMOS are investigated, providing deep insights into its self-heating mechanism and thermal-aware design. Besides, the junction depth of source/drain, ambient temperature and boundary thermal resistance are optimized to mitigate the self-heating effect (SHE) in SOI-ATG LDMOS. Furthermore, different trench dielectrics are also compared to achieve an electro-thermal co-optimization of SOI-ATG LDMOS.","PeriodicalId":6693,"journal":{"name":"2021 6th International Conference on Integrated Circuits and Microsystems (ICICM)","volume":"37 1","pages":"210-213"},"PeriodicalIF":0.0000,"publicationDate":"2021-10-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Electro-thermal Investigation on SOI Accumulation Mode Tri-gate LDMOS\",\"authors\":\"Zhangjun Shi, Xiaojin Li, Yabin Sun, Yanling Shi\",\"doi\":\"10.1109/ICICM54364.2021.9660247\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An electro-thermal co-optimization has been carried out on silicon-on-insulator (SOI) accumulation mode tri-gate (ATG) LDMOS by TCAD simulation. Internal electric field, temperature distribution, critical heat removal path and the thermal resistance of SOI-ATG LDMOS are investigated, providing deep insights into its self-heating mechanism and thermal-aware design. Besides, the junction depth of source/drain, ambient temperature and boundary thermal resistance are optimized to mitigate the self-heating effect (SHE) in SOI-ATG LDMOS. Furthermore, different trench dielectrics are also compared to achieve an electro-thermal co-optimization of SOI-ATG LDMOS.\",\"PeriodicalId\":6693,\"journal\":{\"name\":\"2021 6th International Conference on Integrated Circuits and Microsystems (ICICM)\",\"volume\":\"37 1\",\"pages\":\"210-213\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-10-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 6th International Conference on Integrated Circuits and Microsystems (ICICM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICICM54364.2021.9660247\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 6th International Conference on Integrated Circuits and Microsystems (ICICM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICICM54364.2021.9660247","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Electro-thermal Investigation on SOI Accumulation Mode Tri-gate LDMOS
An electro-thermal co-optimization has been carried out on silicon-on-insulator (SOI) accumulation mode tri-gate (ATG) LDMOS by TCAD simulation. Internal electric field, temperature distribution, critical heat removal path and the thermal resistance of SOI-ATG LDMOS are investigated, providing deep insights into its self-heating mechanism and thermal-aware design. Besides, the junction depth of source/drain, ambient temperature and boundary thermal resistance are optimized to mitigate the self-heating effect (SHE) in SOI-ATG LDMOS. Furthermore, different trench dielectrics are also compared to achieve an electro-thermal co-optimization of SOI-ATG LDMOS.