钛镁合金扩散诱导固相键合过程中接头形成动力学

Kavian Omar Cooke
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引用次数: 0

摘要

本研究探讨了钛与镁的扩散键合。研究了键合区内的微观结构演变和金属间化合物的形成。利用扫描电子显微镜(SEM)和能谱仪(EDS)对键的结构和组成进行了表征。使用显微硬度测试来评估键的力学性能,以确定整个接合区域的硬度变化,而剪切强度测量用于评估接合强度。结果表明:Ti6Al-4V与Mg (Az31)的固相扩散结合导致在连接区域内形成ti3al和ti2mg3al 18反应层;粘结强度随粘结时间的增加而增加,当粘结时间为1小时时,粘结强度可达116 MPa。节理的形成和强度是由于分散的金属间化合物在节理界面处成核而引起的弥散强化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Kinetics of joint formation during diffusion induced solid state bonding of titanium and magnesium alloys
This study explores the diffusion bonding of titanium to magnesium. The microstructural evolution and intermetallic compounds formed within the bond region are studied. The microstructure and composition of the bonds were characterized using a Scanning Electron Microscope (SEM) equipped with Energy Dispersive Spectroscopy (EDS). The mechanical properties of the bonds were evaluated using a micro-hardness test to determine the hardness variation across the joint region, while shear strength measurements were used to assess the joint strength. The results indicated that solid-state diffusion bonding of Ti6Al-4V and Mg (Az31) lead to the formation of Ti 3 Al and Ti 2 Mg 3 Al 18 reaction layers within the joint region. Evaluation of the mechanical properties of the bonds revealed that the bond strength increased with increase bonding time to 116 MPa at a bond time of 1 hr. The joint formation and strength were attributed to dispersion strengthening due to the nucleation of dispersed intermetallic compounds at the joint interface.
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