保温时间对真空扩散焊异种奥氏体不锈钢-钛合金接头结合强度和界面组织的影响

Q4 Engineering

Academic Journal of Manufacturing Engineering Pub Date : 2022-06-01 DOI:10.37255/jme.v17i2pp073-078

A. Negemiya, Tushar Sonar, Rajakumar Selvarajan

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引用次数: 0

摘要

研究了保温时间对异种奥氏体不锈钢(ASS) -钛(Ti)合金真空扩散连接接头界面显微组织和结合强度的影响。在900⁰C温度和14 MPa压力的真空室中分别保温30、45、60、75和90分钟，制备了不同类型的ASS -钛合金接头。采用滑枕拉伸试验对ASS -钛合金接头的结合强度进行了评价。显微硬度测量垂直于接头界面进行。利用光学显微镜对接头界面的微观组织进行了分析。利用x射线衍射(XRD)分析了接头界面金属间化合物的演化过程。接头界面的微观结构与接头的结合强度有关。

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Effect of Holding Time on Bonding Strength and Joint Interface Microstructure of Vacuum Diffusion Bonded Dissimilar Austenitic Stainless Steel - Titanium Alloy Joints

In this investigation, the effect of holding time on the microstructure of joint interface and bonding strength of vacuum diffusion bonded dissimilar austenitic stainless (ASS) – titanium (Ti) alloy joints were investigated. The dissimilar joints of ASS - Ti alloy were developed using the holding time of 30, 45, 60, 75 and 90 minutes in a vacuum chamber at a temperature of 900⁰C and pressure of 14 MPa. The bonding strength of ASS – Ti alloy joints was evaluated using the ram tensile test. The microhardness survey was done perpendicular to the joint interface. The microstructure of the joint interface was analyzed using optical microscopy (OM). The evolution of intermetallic compounds at the joint interface was analyzed using X-ray diffraction (XRD). The microstructure of the joint interface was correlated to the bonding strength of joints.

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来源期刊

Academic Journal of Manufacturing Engineering Engineering-Industrial and Manufacturing Engineering

CiteScore

0.40

自引率

0.00%

发文量