{"title":"非平面焦平面与硅基光电探测器","authors":"Zhao Ma, Xiaochen Wang, H. Cho, Kyle Renshaw","doi":"10.1109/IPCON.2017.8116004","DOIUrl":null,"url":null,"abstract":"A fabrication process is demonstrated to form curved image sensors based on CMOS image sensor technology. A stretchable polymer backplane is fabricated monolithically on the backside of the wafer before a DRIE etch is performed to segment the wafer and make the circuit stretchable.","PeriodicalId":6657,"journal":{"name":"2017 IEEE Photonics Conference (IPC) Part II","volume":"19 1","pages":"55-56"},"PeriodicalIF":0.0000,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Nonplanar focal plane with silicon based photodetector\",\"authors\":\"Zhao Ma, Xiaochen Wang, H. Cho, Kyle Renshaw\",\"doi\":\"10.1109/IPCON.2017.8116004\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A fabrication process is demonstrated to form curved image sensors based on CMOS image sensor technology. A stretchable polymer backplane is fabricated monolithically on the backside of the wafer before a DRIE etch is performed to segment the wafer and make the circuit stretchable.\",\"PeriodicalId\":6657,\"journal\":{\"name\":\"2017 IEEE Photonics Conference (IPC) Part II\",\"volume\":\"19 1\",\"pages\":\"55-56\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE Photonics Conference (IPC) Part II\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPCON.2017.8116004\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE Photonics Conference (IPC) Part II","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPCON.2017.8116004","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Nonplanar focal plane with silicon based photodetector
A fabrication process is demonstrated to form curved image sensors based on CMOS image sensor technology. A stretchable polymer backplane is fabricated monolithically on the backside of the wafer before a DRIE etch is performed to segment the wafer and make the circuit stretchable.
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