未来SoC设计挑战与解决方案

C. C. Chen, Ed Cheng
{"title":"未来SoC设计挑战与解决方案","authors":"C. C. Chen, Ed Cheng","doi":"10.1109/ISQED.2002.996800","DOIUrl":null,"url":null,"abstract":"SoC (system on a chip) design creates tremendous design challenges to the traditional VLSI ASIC design. It covers not only the traditional DSM (deep sub-micron) issues but also the integration issues such as IP and signal integrity especially for integrated digital/analog system such as Bluetooth. Besides. power consumption and power delivery also impose huge design constraints to the already difficult situation especially for the portable and mobile devices. This talk will introduce and analysis the potential SoC issues and potential solutions from the architecture level to the circuit level.","PeriodicalId":20510,"journal":{"name":"Proceedings International Symposium on Quality Electronic Design","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"Future SoC design challenges and solutions\",\"authors\":\"C. C. Chen, Ed Cheng\",\"doi\":\"10.1109/ISQED.2002.996800\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"SoC (system on a chip) design creates tremendous design challenges to the traditional VLSI ASIC design. It covers not only the traditional DSM (deep sub-micron) issues but also the integration issues such as IP and signal integrity especially for integrated digital/analog system such as Bluetooth. Besides. power consumption and power delivery also impose huge design constraints to the already difficult situation especially for the portable and mobile devices. This talk will introduce and analysis the potential SoC issues and potential solutions from the architecture level to the circuit level.\",\"PeriodicalId\":20510,\"journal\":{\"name\":\"Proceedings International Symposium on Quality Electronic Design\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-08-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings International Symposium on Quality Electronic Design\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISQED.2002.996800\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings International Symposium on Quality Electronic Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISQED.2002.996800","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 11

摘要

SoC(片上系统)设计对传统的VLSI ASIC设计提出了巨大的设计挑战。它不仅涵盖了传统的DSM(深亚微米)问题,还包括集成问题,如IP和信号完整性,特别是对于集成数字/模拟系统,如蓝牙。除了。功耗和功率传输也对已经很困难的情况施加了巨大的设计限制,特别是对于便携式和移动设备。本讲座将介绍和分析潜在的SoC问题和潜在的解决方案,从架构层面到电路层面。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Future SoC design challenges and solutions
SoC (system on a chip) design creates tremendous design challenges to the traditional VLSI ASIC design. It covers not only the traditional DSM (deep sub-micron) issues but also the integration issues such as IP and signal integrity especially for integrated digital/analog system such as Bluetooth. Besides. power consumption and power delivery also impose huge design constraints to the already difficult situation especially for the portable and mobile devices. This talk will introduce and analysis the potential SoC issues and potential solutions from the architecture level to the circuit level.
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