半导体器件环氧树脂衬底空间电荷行为研究

Naho Saito, Kosuke Sato, H. Miyake, Yasuhiro Tanaka
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引用次数: 0

摘要

近年来,以碳化硅、氮化镓等为材料的新型半导体器件得到了发展,这些器件在高电场下也能在高温下工作。虽然可以通过使用它们来使设备小型化,但半导体元件的绝缘衬底暴露在比以往任何时候都更严峻的热和电环境中。因此,要求绝缘基材在高温下具有较高的绝缘性能。在本研究中,我们重点研究了环氧树脂作为衬底,并特别研究了它们中的空间电荷积累行为,因为它们有望影响高温下高电场下的绝缘性能。特别地,为了研究环氧树脂中杂质的影响,对热固性后进一步退火的样品进行了空间电荷分布测量。结果表明,真空退火提高了环氧树脂在100℃下的空间电荷积累性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Investigation of Space Charge Behavior in Epoxy Resin Substrate of Semiconductor Devices
In recent years, new semiconductor devices using SiC, GaN, etc. that can be operated even at high temperature under high electric field have been developed. While it is possible to miniaturize the equipment by using them, the insulating substrate for the semiconductor element is exposed to a more severe thermal and electrical environment than ever. Therefore, the insulating substrate is required to have high insulating properties at high temperatures. In this research, we focus on epoxy resin to apply them as the substrate, and we especially investigated the space charge accumulation behaviors in them, because they were expected to affect the insulating performance at high temperature under high electric field. In particular, to investigate the effect of impurities in the epoxy resin, space charge distribution measurements were performed on samples that were further annealing after thermosetting. As a result, the annealing under vacuum condition improves the space charge accumulation properties of epoxy resins at temperature of 100 °C.
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