单晶钼焊接接头杂散晶粒形成的ANSYS有限元模拟

IF 0.6 4区 材料科学 Q4 MATERIALS SCIENCE, MULTIDISCIPLINARY
Ma Yan, Xu Yanze, Wang Jianju
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引用次数: 4

摘要

在以往的研究中,在单晶钼的电子束焊接(EBW)接头中观察到杂散晶粒。本文采用有限元法,结合理论分析,对杂散晶粒形成进行了评价。模型中考虑了钼的温度相关热性能,并采用了三维体积移动双椭球热源。利用描述杂散颗粒形成程度的参数Φ与热梯度G和生长速度V的关系。从不同工况下的仿真结果中提取模型的温度和热梯度数据,并计算Φ。研究了焊接功率Q和焊接速度S等焊接参数对焊缝杂散晶粒形成的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Assessment of Stray Grain Formation in Weld Joint of Single Crystal Molybdenum by ANSYS FE Simulation

Stray grains were observed in an electron beam welded (EBW) joint of single crystal molybdenum (Mo) in former studies. In the present paper, finite element (FE) method, combining the theoretical analysis, was used for evaluating the stray grain formation. Temperature-dependent thermal properties of molybdenum were incorporated in the model and a 3D volumetric moving double-ellipsoid heat source was applied. The relationship of parameter Φ, describing the degree of stray grain formation, to the thermal gradient G and the growth velocity V was used. Temperature and thermal gradient data of the model were extracted from simulation results under different operating conditions, and Φ was calculated. The effects of the welding parameters, including welding power Q and welding speed S on the formation of the weld stray grain were obtained.

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来源期刊
稀有金属材料与工程
稀有金属材料与工程 工程技术-材料科学:综合
CiteScore
1.30
自引率
57.10%
发文量
17973
审稿时长
4.2 months
期刊介绍:
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