SiC纤维在缓慢裂纹扩展过程中的裂纹桥接及SiCSiCf复合材料的断裂韧性

Christopher R. Jones , Charles H. Henager Jr. , Russell H. Jones
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引用次数: 9

摘要

陶瓷基复合材料在亚临界裂纹扩展(SCG)条件下,随着基体裂纹长度的增加,其韧性增加,承载能力保持不变。随着裂缝的扩大,形成一个更广泛的桥接区,使其能够承受比断裂试验预期的更大的应力强度。裂纹分岔可能有助于这种影响,但不太可能是主要原因。这些测试的结果令人鼓舞,并扩大了这些类型的材料在需要应力下长期稳定性的应用中的可能用途。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Crack bridging by SiC fibers during slow crack growth and the resultant fracture toughness of SiCSiCf composites

Ceramic matrix composites show the uncommon and promising property of increasing their toughness and maintaining their load-carrying capacity with increasing matrix crack lengths under conditions of subcritical crack growth (SCG). As the crack grows, formation of a more extensive bridging zone allows it to withstand far greater stress intensities than would be expected from fracture tests. Crack bifurcation possibly contributes to this effect but is not likely to be the primary cause. The results of these tests are encouraging and expand the possible uses of these types of materials in applications that require long-term stability under stress.

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