新型光伏组件架构的可靠性和制造演示以及封装的流线型方法

Samuel J. Ellis, Larry Maple, T. Shimpi, A. Pavgi, G. Tamizhmani, Walajabad Sampth, K. Barth
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引用次数: 0

摘要

新的光伏组件封装技术正在开发中,通过降低制造成本和提高组件可靠性,可以帮助实现能源部SunShot公用事业太阳能成本目标0.03美元/千瓦时。基于真空层压的封装可能需要长达20分钟才能完成,运营成本高,并且需要很大的工厂占地面积。当前的封装体系结构是几个模块退化问题的根源。采用新的模块结构和简化的工艺流程,每个工艺的周期时间低于30秒,提高了可靠性。模块在工业工具上制造,并经过多次加速测试。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Reliability and Manufacturing Demonstrations of a New Photovoltaic Module Architecture and Streamlined Approach to Encpasulation
New photovoltaic module encapsulation technology is under development that can help achieve Department of Energy SunShot utility solar cost goals of $0.03/kWh by lowering manufacturing cost and improving module reliability. Vacuum lamination-based encapsulation can take up to 20 minutes to complete, has high operating cost, and requires a large factory footprint. Current encapsulation architectures are the source of several module degradation issues. A new module architecture and streamlined process is demonstrated to show under 30 second cycle time for each process and improved reliability. Modules are fabricated on industry ready tools and undergo several accelerated tests.
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