D. Dumas, J. Kirdoda, P. Vines, K. Kuzmenko, R. Millar, G. Buller, D. Paul
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引用次数: 1
摘要
锗硅SPAD器件有望在车载激光雷达[1]、量子光学、量子通信和其他应用中具有成本效益。以往使用平台结构的Ge on SI SPAD器件显示出高暗计数率(DCR)和低单光子探测效率(SPDE)[2]。本文所展示的新型平面器件在短波红外波段具有低DCR和高SPDE。这种新颖的设计通过使用植入的电荷片和小的顶部接触区域来限制高场区域,从而获得更好的性能。这种设计消除了蚀刻侧壁和高电场之间的相互作用。我们已经制作了直径为100 μm的电荷片和直径为90 μm的顶部接触的器件。TCSPC测量分别在78 K, 100 K, 125 K下进行,使用1310 nm光,平均每脉冲<< 1光子,50 ns栅极时间(图1)。在125 K的器件温度下,测量到Ge-on-Si spad的最高SPDE为38%,过量偏置为5.5%,在78 K下显示出创纪录的低NEP为2× 10−16WHz−1/2。
Ge on Si SPAD devices hold promise for cost effective use in vehicular LIDAR [1], quantum optics, quantum communications, and other applications. Previous Ge on SI SPAD devices using mesa structures have shown high dark count rate (DCR) and low single photon detection efficiency (SPDE) [2]. The novel planar device design demonstrated here shows low DCR and high SPDE at short-wave infrared wavelengths. The novel design allows better performance by confining the high field regions using an implanted charge sheet and small top contact region. This design removes the interaction between etched sidewalls and high electric fields seen in mesa devices. We have fabricated devices with a 100 μm diameter charge sheet and a 90 μ m diameter top contact. TCSPC measurements were taken at 78 K, 100 K, 125 K, using 1310 nm light with << 1 photon per pulse on average and 50 ns gate times (Fig. 1). A record high SPDE of 38% for Ge-on-Si SPADs was measured for a device temperature of 125 K with an excess bias of 5.5 %, and a record low NEP of 2× 10−16WHz−1/2 was demonstrated at 78 K.