NUMANA:用于三维集成电路的混合数值和分析热模拟器

2013 Design, Automation & Test in Europe Conference & Exhibition (DATE) Pub Date : 2013-03-18 DOI:10.7873/DATE.2013.282

Yu-Min Lee, T. Wu, Pei-Yu Huang, C. Yang

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引用次数: 6

摘要

结合分析和数值模拟技术，开发了一种能够有效处理复杂材料结构的混合热模拟器NUMANA，用于估算三维集成电路的温度分布，与商用工具ANSYS相比，其最大相对误差仅为1.84%。与著名的线性系统求解器SuperLU[1]相比，它可以实现数量级的加速。

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NUMANA: A hybrid numerical and analytical thermal simulator for 3-D ICs

By combining analytical and numerical simulation techniques, this work develops a hybrid thermal simulator, NUMANA, which can effectively deal with complicated material structures, to estimate the temperature profile of a 3-D IC. Compared with a commercial tool, ANSYS, its maximum relative error is only 1.84%. Compared with a well known linear system solver, SuperLU [1], it can achieve orders of magnitude speedup.

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2013 Design, Automation & Test in Europe Conference & Exhibition (DATE)

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