Failure Analysis for Package of Gold Wire Bonding from Practical Case

A practical case related to package failure from field was presented in this paper, traditional equipment (cross-section, oven, SEM) was used to reveal 2 of mixed factors that may trigger failure of package. In the final conclusion, we considered the failure was strongly related to crack between gold wire ball & pad and concave molding of package when using 1~1.5 years from field. Another purpose of this paper is that author would like to draw industry’s attention regarding to quality standard of wire bonding. In current standard only stated the pull strength of wire bonding, but it did not control the structure quality of wire bonding, bad connection of electrical property may result in temporal failure of electronic product and not easy to find out the root cause of failure, this situation may influence different level of product, e.g. military, satellite, medical instrument, air industry, server, personal computer.