James K. Woodell, T. Smith
{"title":"出于所有正当理由的技术转让","authors":"James K. Woodell, T. Smith","doi":"10.21300/18.4.2017.295","DOIUrl":null,"url":null,"abstract":"1Economic Development and Community Engagement, Association of Public and Land-grant Universities, Washington, DC, USA 2Association of American Universities, Washington, DC, USA Technology and Innovation, Vol. 18, pp. 295-304, 2017 Printed in the USA. All rights reserved. Copyright © 2017 National Academy of Inventors. ISSN 1949-8241 • E-ISSN 1949-825X http://dx.doi.org/10.21300/18.4.2017.295 www.technologyandinnovation.org","PeriodicalId":44009,"journal":{"name":"Technology and Innovation","volume":"63 1","pages":"295-304"},"PeriodicalIF":0.7000,"publicationDate":"2017-03-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Technology Transfer for All the Right Reasons\",\"authors\":\"James K. Woodell, T. Smith\",\"doi\":\"10.21300/18.4.2017.295\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"1Economic Development and Community Engagement, Association of Public and Land-grant Universities, Washington, DC, USA 2Association of American Universities, Washington, DC, USA Technology and Innovation, Vol. 18, pp. 295-304, 2017 Printed in the USA. All rights reserved. Copyright © 2017 National Academy of Inventors. ISSN 1949-8241 • E-ISSN 1949-825X http://dx.doi.org/10.21300/18.4.2017.295 www.technologyandinnovation.org\",\"PeriodicalId\":44009,\"journal\":{\"name\":\"Technology and Innovation\",\"volume\":\"63 1\",\"pages\":\"295-304\"},\"PeriodicalIF\":0.7000,\"publicationDate\":\"2017-03-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Technology and Innovation\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.21300/18.4.2017.295\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"MULTIDISCIPLINARY SCIENCES\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Technology and Innovation","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.21300/18.4.2017.295","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MULTIDISCIPLINARY SCIENCES","Score":null,"Total":0}
引用次数: 5
Technology Transfer for All the Right Reasons
1Economic Development and Community Engagement, Association of Public and Land-grant Universities, Washington, DC, USA 2Association of American Universities, Washington, DC, USA Technology and Innovation, Vol. 18, pp. 295-304, 2017 Printed in the USA. All rights reserved. Copyright © 2017 National Academy of Inventors. ISSN 1949-8241 • E-ISSN 1949-825X http://dx.doi.org/10.21300/18.4.2017.295 www.technologyandinnovation.org