{"title":"铜的化学机械刨平:pH效应","authors":"T. Du, V. Desai","doi":"10.1023/A:1026353028626","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":16230,"journal":{"name":"Journal of Materials Science Letters","volume":"184 1","pages":"1623-1625"},"PeriodicalIF":0.0000,"publicationDate":"2003-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"18","resultStr":"{\"title\":\"Chemical mechanical planarization of copper: pH effect\",\"authors\":\"T. Du, V. Desai\",\"doi\":\"10.1023/A:1026353028626\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":16230,\"journal\":{\"name\":\"Journal of Materials Science Letters\",\"volume\":\"184 1\",\"pages\":\"1623-1625\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"18\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Materials Science Letters\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1023/A:1026353028626\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science Letters","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1023/A:1026353028626","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}