后退火对聚钨栅中氧化物电荷击穿和界面状态的影响

Byunghak Lee, Sangcheol Kim, Dong-chan Kim, Taewoo Kim, Jungyeol Park, Youngho Choe, Y. Woo, E. Ryou, Jongoh Kim, J. Om
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引用次数: 0

摘要

实验研究了氧化电荷击穿率(Q/sub / BD/)和器件降解对聚钨栅极工艺中RTA和FA复合退火后的影响。实验结果表明,较低的RTA温度和较短的RTA时间提高了Q/sub / BD/和降解性能。而FA/RTA退火顺序更有利于改善Q/sub / BD/, RTA/FA退火顺序有利于改善器件的劣化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The effects of post annealing on oxide-charge-to-breakdown and interface state in tungsten polycide gate
The dependence of oxide charge-to-breakdown (Q/sub BD/) and device degradation on the combined post annealing of RTA and FA in the tungsten polycide gate technology have been experimentally investigated. The experimental results suggest that Q/sub BD/ and degradation are improved by lower temperature and shorter time of RTA. Whereas the FA/RTA annealing sequence is more advantageous for improving Q/sub BD/, the RTA/FA annealing sequence is good for improving device degradation.
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