基于稀疏回归的空间变异分解研究

Wangyang Zhang, K. Balakrishnan, Xin Li, D. Boning, Rob A. Rutenbar
{"title":"基于稀疏回归的空间变异分解研究","authors":"Wangyang Zhang, K. Balakrishnan, Xin Li, D. Boning, Rob A. Rutenbar","doi":"10.1109/ICCAD.2011.6105321","DOIUrl":null,"url":null,"abstract":"In this paper, we propose a new technique to accurately decompose process variation into two different components: (1) spatially correlated variation, and (2) uncorrelated random variation. Such variation decomposition is important to identify systematic variation patterns at wafer and/or chip level for process modeling, control and diagnosis. We demonstrate that spatially correlated variation carries a unique sparse signature in frequency domain. Based upon this observation, an efficient sparse regression algorithm is applied to accurately separate spatially correlated variation from uncorrelated random variation. An important contribution of this paper is to develop a fast numerical algorithm that reduces the computational time of sparse regression by several orders of magnitude over the traditional implementation. Our experimental results based on silicon measurement data demonstrate that the proposed sparse regression technique can capture spatially correlated variation patterns with high accuracy. The estimation error is reduced by more than 3.5× compared to other traditional methods.","PeriodicalId":6357,"journal":{"name":"2011 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2011-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":"{\"title\":\"Toward efficient spatial variation decomposition via sparse regression\",\"authors\":\"Wangyang Zhang, K. Balakrishnan, Xin Li, D. Boning, Rob A. Rutenbar\",\"doi\":\"10.1109/ICCAD.2011.6105321\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we propose a new technique to accurately decompose process variation into two different components: (1) spatially correlated variation, and (2) uncorrelated random variation. Such variation decomposition is important to identify systematic variation patterns at wafer and/or chip level for process modeling, control and diagnosis. We demonstrate that spatially correlated variation carries a unique sparse signature in frequency domain. Based upon this observation, an efficient sparse regression algorithm is applied to accurately separate spatially correlated variation from uncorrelated random variation. An important contribution of this paper is to develop a fast numerical algorithm that reduces the computational time of sparse regression by several orders of magnitude over the traditional implementation. Our experimental results based on silicon measurement data demonstrate that the proposed sparse regression technique can capture spatially correlated variation patterns with high accuracy. The estimation error is reduced by more than 3.5× compared to other traditional methods.\",\"PeriodicalId\":6357,\"journal\":{\"name\":\"2011 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-11-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"14\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICCAD.2011.6105321\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCAD.2011.6105321","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 14

摘要

本文提出了一种将过程变化精确分解为两个不同分量的新技术:(1)空间相关变化和(2)不相关随机变化。这种变异分解对于在晶圆和/或芯片水平上识别系统变异模式对于过程建模、控制和诊断非常重要。我们证明了空间相关变异在频域具有独特的稀疏特征。在此基础上,采用一种高效的稀疏回归算法,将空间相关变异与不相关随机变异精确分离。本文的一个重要贡献是开发了一种快速的数值算法,使稀疏回归的计算时间比传统的实现减少了几个数量级。基于硅测量数据的实验结果表明,稀疏回归技术可以高精度地捕获空间相关的变化模式。与其他传统方法相比,估计误差降低了3.5倍以上。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Toward efficient spatial variation decomposition via sparse regression
In this paper, we propose a new technique to accurately decompose process variation into two different components: (1) spatially correlated variation, and (2) uncorrelated random variation. Such variation decomposition is important to identify systematic variation patterns at wafer and/or chip level for process modeling, control and diagnosis. We demonstrate that spatially correlated variation carries a unique sparse signature in frequency domain. Based upon this observation, an efficient sparse regression algorithm is applied to accurately separate spatially correlated variation from uncorrelated random variation. An important contribution of this paper is to develop a fast numerical algorithm that reduces the computational time of sparse regression by several orders of magnitude over the traditional implementation. Our experimental results based on silicon measurement data demonstrate that the proposed sparse regression technique can capture spatially correlated variation patterns with high accuracy. The estimation error is reduced by more than 3.5× compared to other traditional methods.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信