{"title":"回收利用。集成电路封装中含铅框架金属的回收。","authors":"N. Rokukawa, H. Sakamoto","doi":"10.2473/SHIGENTOSOZAI.113.1071","DOIUrl":null,"url":null,"abstract":"Recovery of leaded-frame metals from IC (integrated circuit) packages was carried out by crashing. IC packages were taken off from printed wiring boards, and these IC packages are DIP (dual in-line package) type having two lines of pins sealed with resin composition such as epoxy resin. IC package is composed of IC chips, metal lead frame, and sealing material, the content of metal is different depending on types of IC package, and lead frame are categorized into Fe-Ni alloy, Fe-Ni-Co alloy, and Cu alloy according to contained metal. Packaging material made by hardening mixture of thermosetting resin and quartz powder was crashed easily. Sealing material was separated easily by crashing regardless of the number of pin and lead frames of iron base alloy was separated easily by a magnet with a magnetic flux as low as 600 gauss.","PeriodicalId":22754,"journal":{"name":"The Mining and Materials Processing Institute of Japan","volume":"23 1","pages":"1071-1073"},"PeriodicalIF":0.0000,"publicationDate":"1997-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Recycling. Recovery of Leaded-Frame Metals from Integrated Circuit Package.\",\"authors\":\"N. Rokukawa, H. Sakamoto\",\"doi\":\"10.2473/SHIGENTOSOZAI.113.1071\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Recovery of leaded-frame metals from IC (integrated circuit) packages was carried out by crashing. IC packages were taken off from printed wiring boards, and these IC packages are DIP (dual in-line package) type having two lines of pins sealed with resin composition such as epoxy resin. IC package is composed of IC chips, metal lead frame, and sealing material, the content of metal is different depending on types of IC package, and lead frame are categorized into Fe-Ni alloy, Fe-Ni-Co alloy, and Cu alloy according to contained metal. Packaging material made by hardening mixture of thermosetting resin and quartz powder was crashed easily. Sealing material was separated easily by crashing regardless of the number of pin and lead frames of iron base alloy was separated easily by a magnet with a magnetic flux as low as 600 gauss.\",\"PeriodicalId\":22754,\"journal\":{\"name\":\"The Mining and Materials Processing Institute of Japan\",\"volume\":\"23 1\",\"pages\":\"1071-1073\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"The Mining and Materials Processing Institute of Japan\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.2473/SHIGENTOSOZAI.113.1071\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"The Mining and Materials Processing Institute of Japan","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.2473/SHIGENTOSOZAI.113.1071","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Recycling. Recovery of Leaded-Frame Metals from Integrated Circuit Package.
Recovery of leaded-frame metals from IC (integrated circuit) packages was carried out by crashing. IC packages were taken off from printed wiring boards, and these IC packages are DIP (dual in-line package) type having two lines of pins sealed with resin composition such as epoxy resin. IC package is composed of IC chips, metal lead frame, and sealing material, the content of metal is different depending on types of IC package, and lead frame are categorized into Fe-Ni alloy, Fe-Ni-Co alloy, and Cu alloy according to contained metal. Packaging material made by hardening mixture of thermosetting resin and quartz powder was crashed easily. Sealing material was separated easily by crashing regardless of the number of pin and lead frames of iron base alloy was separated easily by a magnet with a magnetic flux as low as 600 gauss.
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