微服务器+微交换机=微数据中心

F. Abel, A. Doering
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引用次数: 0

摘要

许多商业和科学领域的计算工作负载对总吞吐量和能源效率有很高的要求。例如,将在南非和澳大利亚建造的最大的射电望远镜结合了成本、性能和功率目标,这些目标在安装之前无法通过技术发展来满足。在处理器体系结构中,可以观察到单线程性能在成本和功率效率之间的设计权衡。因此,为了获得较高的系统功率效率,必须采用大规模并行。为了保持线路长度,从而减少网络延迟、能量损失和成本,计算节点和网络交换机的体积必须减少到最小âĂŞ因此有了术语微服务器。我们的DOME微服务器计算卡尺寸为130 × 7.5 × 65 mm3。所展示的交换模块被限制在相同的面积(140 × 55mm2),但由于630针高速连接器,更深(40mm)。对于64端口的10gb以太网(10Gbase-KR),我们的交换机最大消耗约150W。除了开关ASIC (Intel FM6000系列)外,电源转换器、时钟生成、配置存储器和管理处理器都集成在第二块PCB上。交换机管理(âĂIJControl PointâĂİ)在单独的计算节点上实现。在讨论中,将讨论将管理集成到交换机中的选项(与现在相同的音量)。另一个涉及的主题是微服务器的冷却,特别是交换机的冷却,在基础设施和模块上的热管中使用(热)水。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Microserver + micro-switch = micro-datacenter
Many computational workloads from commercial and scientific fields have high demands in total throughput, and energy efficiency. For example the largest radio telescope, to be built in South Africa and Australia combines cost, performance and power targets that cannot be met by the technological development until its installation. In processor architecture a design tradeoff between cost and power efficiency against single-thread performance is observed. Hence, to achieve a high system power efficiency, large-scale parallelism has to be employed. In order to maintain wire length, and hence network delays, energy losses, and cost, the volume of compute nodes and network switches has to be reduced to a minimum âĂŞ hence the term microserver. Our DOME microserver compute card measures 130 by 7.5 by 65 mm3. The presented switch module is confined to the same area (140 by 55 mm2), yet is deeper (40mm) because of the 630-pin high-speed connector. For 64 ports of 10Gbit Ethernet (10Gbase-KR) our switch consumes about 150W maximal. In addition to the switch ASIC (Intel FM6000 series), the power converters, clock generation, configuration memory and management processor is integrated on a second PCB. The switch management (âĂIJControl PointâĂİ) is implemented in a separate compute node. In the talk options to integrate the management into the switch (same volume as now) will be discussed. Another topic covered is the cooling of the microserver, and of the switch in particular, using (warm) water in the infrastructure and heat pipes on the module.
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