脉冲镀中质量输运的实验研究

M. Datta, D. Landolt
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引用次数: 56

摘要

研究了单脉冲和多脉冲电沉积铜的过程。在扩散池和旋转半球形电极中获得的实验结果与发表的不同程度的数学复杂性和复杂性的理论计算进行了比较。Ibl提出的简单双扩散层模型给出了足够的脉冲限制电流密度值,适用于许多实际用途。通过对模型进行半经验修正,可以进一步提高模型与实验的一致性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Experimental investigation of mass transport in pulse plating

Mass transport during the electrodeposition of copper from acidified sulphate solution using single and multiple pulses was studied. Experimental results obtained in a diffusion cell and with a rotating hemispherical electrode are compared with published theoretical calculations of various degrees of mathematical sophistication and complexity. The simple duplex diffusion-layer model proposed by Ibl gives adequate values of the pulse limiting current density for many practical purposes. The agreement with experiment can be further improved by using a semi-empirical modification of the model.

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