VLSI互连中振荡噪声的验证与测试生成

Arani Sinha, S. Gupta, M. Breuer
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引用次数: 30

摘要

片上互连的电感会引起信号过调和过调,从而导致逻辑错误。通过考虑技术趋势,我们发现在0.13 /spl mu/m技术中,嵌入组合逻辑的局部互连中的噪声可以超过阈值电压。我们展示了这种噪声对不同类型电路的影响。由于工艺变化,噪声的大小会增加。我们提出了一种用于验证和制造测试的矢量生成算法,以检测由电感诱导振荡引起的逻辑值误差。为了方便矢量生成方法,我们推导了解析表达式,作为(i)过冲和欠冲幅度的上升和下降时间的函数,以及(ii)稳定时间,即电路响应沉降到接近最终值的界限所需的时间。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Validation and test generation for oscillatory noise in VLSI interconnects
Inductance of on-chip interconnects gives rise to signal overshoots and undershoots that can cause logic errors. By considering technology trends, we show that in 0.13 /spl mu/m technology such noise in local interconnects embedded in combinational logic can exceed the threshold voltage. We show the impact of such noise on different kinds of circuits. The magnitude of this noise can increase due to process variations. We present an algorithm for generating vectors for validation and manufacturing test to detect logic-value errors caused by inductance induced oscillation. To facilitate the vector generation method, we have derived analytical expressions, as functions of rise and fall times for (i) the magnitude of overshoots and undershoots, and (ii) the settling time, i.e., the time required for the circuit response to settle to a bound close to the final value.
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