NH/ sub3 /和SiH/ sub4 /在185 nm直接光解沉积氮化硅及其在InP misfet中的应用

N. Proust, M. Petitjean, J. Perrin
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引用次数: 0

摘要

讨论了低温直接光解NH/sub 3/-SiH/sub 4/制备高质量氮化硅薄膜及其在InP衬底上的沉积。薄膜的原子组成由核分析确定。为了优化体积和界面特性,在1 MHz下对MIS二极管进行了准静态I(V)和C(V)特性测量。在250℃时,观察到临界场为4 MV/cm,电阻率为6*10/sup 15/ Omega -cm。退火样品。态密度为4*10/sup 11/ cm/sup -2/ eV/sup -1/,由特曼分析确定。本文描述了无凹槽和N/sup +/接触层的InP耗尽型MISFET的初步制备。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Silicon nitride deposited by direct photolysis of NH/sub 3/ and SiH/sub 4/ at 185 nm and its application to InP MISFETs
The preparation of high quality silicon nitride films by direct photolysis of NH/sub 3/-SiH/sub 4/ at low temperature and their deposition onto InP substrates are discussed. The atomic composition of the films is determined by nuclear analysis. In order to optimise bulk and interface properties quasi-static I(V) and C(V) characteristics measurements were performed on MIS diodes at 1 MHz. At 250 degrees C, a critical field of 4 MV/cm and a resistivity of 6*10/sup 15/ Omega -cm are observed. For annealed samples. a density of states of 4*10/sup 11/ cm/sup -2/ eV/sup -1/ is determined by Terman analysis. The fabrication of a preliminary InP depletion mode MISFET without a recess and N/sup +/ contact layer is described.<>
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