X. Qi, Gaofeng Wang, Zhiping Yu, R. Dutton, T. Young, N. Chang
{"title":"用于电路仿真的超大规模集成电路互连片上电感建模和RLC提取","authors":"X. Qi, Gaofeng Wang, Zhiping Yu, R. Dutton, T. Young, N. Chang","doi":"10.1109/CICC.2000.852714","DOIUrl":null,"url":null,"abstract":"On-chip inductance modeling of VLSI interconnects is presented which captures 3D geometry from layout design and process technology information. Analytical formulae are derived for quick and accurate inductance estimation which can be used in circuit simulations and whole chip extraction screening process. Circuit simulations show critical global wire inductive effects as well as power and ground inductive noise.","PeriodicalId":20702,"journal":{"name":"Proceedings of the IEEE 2000 Custom Integrated Circuits Conference (Cat. No.00CH37044)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2000-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"65","resultStr":"{\"title\":\"On-chip inductance modeling and RLC extraction of VLSI interconnects for circuit simulation\",\"authors\":\"X. Qi, Gaofeng Wang, Zhiping Yu, R. Dutton, T. Young, N. Chang\",\"doi\":\"10.1109/CICC.2000.852714\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"On-chip inductance modeling of VLSI interconnects is presented which captures 3D geometry from layout design and process technology information. Analytical formulae are derived for quick and accurate inductance estimation which can be used in circuit simulations and whole chip extraction screening process. Circuit simulations show critical global wire inductive effects as well as power and ground inductive noise.\",\"PeriodicalId\":20702,\"journal\":{\"name\":\"Proceedings of the IEEE 2000 Custom Integrated Circuits Conference (Cat. No.00CH37044)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-05-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"65\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the IEEE 2000 Custom Integrated Circuits Conference (Cat. No.00CH37044)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CICC.2000.852714\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the IEEE 2000 Custom Integrated Circuits Conference (Cat. No.00CH37044)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CICC.2000.852714","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
On-chip inductance modeling and RLC extraction of VLSI interconnects for circuit simulation
On-chip inductance modeling of VLSI interconnects is presented which captures 3D geometry from layout design and process technology information. Analytical formulae are derived for quick and accurate inductance estimation which can be used in circuit simulations and whole chip extraction screening process. Circuit simulations show critical global wire inductive effects as well as power and ground inductive noise.