通过优化28nm Poly/SiON SoC技术的间隔层来改善MOSFET射频性能

Hai Liu, River He, Byunghak Lee
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引用次数: 0

摘要

随着MOSFET的缩小,随着速度(ft)的不断增加,最小噪声系数(NF)难以缩小,其中栅极电阻(Rg)的增加是一个重要的影响因素。在本文中,我们提出了一种新的方法来提高MOSFET射频性能的间隔线优化。在28nm Poly/SiON技术平台上,对于临界尺寸器件(L=27nm),在不影响器件直流性能的情况下,可降低Rg约12%,提高Fmax约7%。这种方法不会在流程中引入任何额外的步骤,并且可以很容易地与传统的Rg缩减方法相结合。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
MOSFET RF performance improvement through spacer profile optimization for 28nm Poly/SiON SoC technology
As the MOSFET scales down, with keeping increasing of speed (ft), minimum noise figure (NF) is difficult to scale down where increasing gate resistance (Rg) is one of crucial impact factors. In this paper, we present a novel approach to boost MOSFET RF performance by spacer profile optimization. It can help reduce Rg about 12% and increase Fmax about 7% for critical size device (L=27nm) without degrading device DC performance on 28nm Poly/SiON technology platform. This approach does NOT introduce any extra steps into process flow and can be easily combined with those traditional Rg reduction methods.
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