一种热阻高、厚度均匀性好的复合粘接用激光释放临时粘接带

Impact Pub Date : 2022-10-26 DOI:10.1109/IMPACT56280.2022.9966704

Izumi Daido, Ryoichi Watanabe, Toshio Takahashi, Masateru Fukuoka

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引用次数: 0

摘要

为了提高半导体封装的性能，对增加I/O带宽的需求非常强烈[1,2,3,4]。混合键合是一种非常重要的互连技术，不仅可以增加I/O带宽，还可以降低信号延迟和互连功耗，以满足下一代高性能计算(HPC)的要求。混合键合技术是3D集成芯片的关键技术。

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A Laser Release Temporary Bonding Tape for Hybrid Bonding Having High Thermal Resistance and Excellent Thickness Uniformity

There has been strong demand to increase I/O bandwidth for higher performance of semiconductor packages [1, 2, 3, 4]. Hybrid bonding is a very important interconnect technology not only to increase the I/O bandwidth but also to reduce signal delay and inter connect power loss for next generation High Performance Computing (HPC) requirements. Also hybrid bonding technology is key technology for 3D IC (Integrated Chiplets).

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